Intel has appointed Seok-Hee Lee as executive vice president of Intel Foundry, tasking him with leading the company’s advanced packaging, system integration, and back-end manufacturing operations, the company announced on June 18, 2026. Lee will report directly to CEO Lip-Bu Tan and oversee a newly dedicated business unit focused on advanced packaging technologies as demand for system-level integration accelerates across artificial intelligence and high-performance computing.
The appointment establishes advanced packaging as a focused business with dedicated leadership, reflecting the growing importance of packaging as a key enabler of performance, power efficiency, and heterogeneous integration across AI systems. Lee will lead all advanced packaging, system integration, back-end technology development, and back-end manufacturing, strengthening Intel’s ability to deliver differentiated, system-level innovation for customers.
Lee joins Intel from SK On, where he served as president and CEO, and previously served as president and CEO of SK hynix. He worked at Intel for approximately 11 years as a principal engineer and group leader for process improvement, bringing deep expertise in advanced process technologies and large-scale manufacturing. Intel CEO Lip-Bu Tan stated that “Advanced packaging and system integration are becoming defining capabilities for next-generation computing systems,” and that Lee’s “insights will help Intel further strengthen our system integration capabilities, allowing us to tightly couple leading-edge logic, memory, networking, and other components to build high-performance computing systems.”
Intel Foundry Restructures Leadership
The appointment marks a significant restructuring of Intel Foundry’s leadership. Naga Chandrasekaran, executive vice president of Intel Foundry, will continue to report to CEO Lip-Bu Tan but will now focus specifically on front-end technology development and front-end manufacturing as the company accelerates the ramp of Intel 18A, Intel 14A, and future technologies. He will also continue to oversee design enablement and end-to-end customer-facing and business enablement functions.
This new focused and scalable operating model reinforces Intel’s commitment to strengthening its technology development and manufacturing engine, giving customers and partners greater confidence in Intel’s ability to deliver with speed, consistency, and predictability. As part of the announcement, Intel also shared that executive vice president Navid Shahriari will be retiring after a distinguished 37-year career at the company.
Lee expressed enthusiasm about the role, stating “Intel is uniquely positioned to lead in advanced packaging as demand for system-level integration accelerates across AI and high-performance computing. I’m excited to return home and to join the Intel team as we help advance the company’s technology leadership, manufacturing capabilities, and customer commitments in this critical area.”
Sources
- Intel Corporation Investor Relations — Official press release announcing Lee’s appointment as EVP of Intel Foundry and the restructuring of foundry leadership
- Business Wire — Distribution of Intel’s official announcement regarding the leadership appointment and foundry organizational changes
- Investing.com — Reporting on Lee’s appointment and the establishment of advanced packaging as a dedicated business unit
- SEMI.org — Biographical information on Lee’s prior work at Intel as a principal engineer and group leader
